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Indoor COB applications


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Display Resolution Explained

Display Effect Explained

Why Flip COB

Flip COB is the most recent trends in LED manufacturing and packaging. This LED has better thermal performance and allow higher power than standard SMD package.

What is Flip COB LED chip?

  • COB: Chip on Board
  • Definition:

COB is a new technology of LED packaging for LED light engine. Multi LED chips are packaged together as one lighting module. When it light up, it looks like a lighting panel.

What is the difference between traditional COB chip and flip COB chip?

(a) and (b) respectively show the schematic diagrams of a traditional wire-bond COB Chip and no wire-bond flip COB chip.

In Figure 1(a), a traditional COB chip is bonded on the MCPCB substrate by bonding epoxy and connects to the circuit electrodes via two bonding wires. The thermal energy generated by the LED chip is dissipated through the chips’ sapphire substrate, bonding epoxy, followed by a MCPCB dielectric layer before reaching the metal core. On the other hand, the flip COB chip shown in Figure 1(b) has the LED chip directly bonded on the circuit electrodes without the bonding wire and epoxy. The heat generated by the LED is coupled through the chip bonding pads, circuit electrodes, MCPCB dielectric layer, and then diffused into the metal core. In comparison, the flip COB chip exhibits less thermal resistance as its thermal dissipating path excludes the sapphire substrate and bonding epoxy that are materials having higher thermal resistance.

Technical Parameters

Parameters UP-0.77B UP-0.925B UP-1.23B
Panel LED COB(1R1G1B) COB(1R1G1B) COB(1R1G1B)
Pixel pitch(mm) 0.77 0.925 1.23
Module Size(W x H x D mm) 148×111 148×111 148×111
Module Resolution(W x H) 192×144 160×120 120×90
Panel Size(W x H x D mm) 293×333 293×333 293×333
Panel Resolution(W x H) 192×432 320×360 240×270
Weight (kg/pcs) 0.68±0.1kg 0.74±0.1kg 1.36±0.1kg
Power consumption(watts/pcs) 53 49 53
Input Voltage(VDC) 3.7 3.7 3.7
Waterproof module surface IP65 IP65 IP65
Cabinet Module quantity (pcs, W x H) 4×3 4×3 4×3
Resolution(pixels/㎡) 768×432 640×360 480×270
Screen ratio 16:9 16:9 16:9
Size(W x H x D mm) 592x333x37.6 592x333x37.6 592x333x37.6
Square(㎡) 0.197 0.197 0.197
Weight(kg/㎡) 5.65 5.65 5.65
Pixel density(pixels/㎡) 1682980 1168736 657414
Cabinet Material & Color Die-casting Aluminum, Black
Waterproof IP3X IP3X IP3X
Flatness of the box(mm) ≤0.15 ≤0.15 ≤0.15
Optical Parameters Color temperature adjustable(K) 3000-10000 3000-10000 3000-10000
Color Gamut ≥105% NTSC ≥105% NTSC ≥105% NTSC
Brightness(nits)after correction 0-600 0-600 0-600
White color coordinates TYP x=0.285,y=0.300±0.003 (9000K standard)
Viewing angle, horizontal(°) ≥160 ≥160 ≥160
Viewing angle, vertical(°) ≥160 ≥160 ≥160
Contrast ratio  15000:1  15000:1  15000:1
Electrical Parameters Power consumption, Max.(watts/㎡) 540 500 540
Power consumption, Typical(watts/㎡) 180 167 180
Input voltage(V) AC 100-240  (50/60HZ) AC 100-240  (50/60HZ) AC 100-240  (50/60HZ)
Visual Refresh Drive method 1/64 duty scans 1/54 duty scans 1/60 duty scans
Frame frequency(HZ) 50&60 50&60 50&60
Refresh Rate(HZ) 3840 3840 3840
Grey scale(bit) 14 13 13
Applications

Environment

LED life time(H) 100000 100000 100000
Operating temperature(℃)  -10~+40  -10~+40  -10~+40
Storage temperature(℃)  -40~+60  -40~+60  -40~+60
Operating humidity(RH) +10~+85%(non-condensing) +10~+85%(non-condensing) +10~+85%(non-condensing)
Storage humidity(RH) +10~+60%(non-condensing) +10~+60%(non-condensing) +10~+60%(non-condensing)

Note: Above parameters only reference, the final interpretation right of the above parameters belongs to ELITESDISPLAY TECHNOLOGY CO., LTD.