Ultrapixel Commercial Series
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Flip COB is the most recent trends in LED manufacturing and packaging. This LED has better thermal performance and allow higher power than standard SMD package.
COB is a new technology of LED packaging for LED light engine. Multi LED chips are packaged together as one lighting module. When it light up, it looks like a lighting panel.
(a) and (b) respectively show the schematic diagrams of a traditional wire-bond COB Chip and no wire-bond flip COB chip.
In Figure 1(a), a traditional COB chip is bonded on the MCPCB substrate by bonding epoxy and connects to the circuit electrodes via two bonding wires. The thermal energy generated by the LED chip is dissipated through the chips’ sapphire substrate, bonding epoxy, followed by a MCPCB dielectric layer before reaching the metal core. On the other hand, the flip COB chip shown in Figure 1(b) has the LED chip directly bonded on the circuit electrodes without the bonding wire and epoxy. The heat generated by the LED is coupled through the chip bonding pads, circuit electrodes, MCPCB dielectric layer, and then diffused into the metal core. In comparison, the flip COB chip exhibits less thermal resistance as its thermal dissipating path excludes the sapphire substrate and bonding epoxy that are materials having higher thermal resistance.
Parameters | UP-0.77B | UP-0.925B | UP-1.23B | |
Panel | LED | COB(1R1G1B) | COB(1R1G1B) | COB(1R1G1B) |
Pixel pitch(mm) | 0.77 | 0.925 | 1.23 | |
Module Size(W x H x D mm) | 148×111 | 148×111 | 148×111 | |
Module Resolution(W x H) | 192×144 | 160×120 | 120×90 | |
Panel Size(W x H x D mm) | 293×333 | 293×333 | 293×333 | |
Panel Resolution(W x H) | 192×432 | 320×360 | 240×270 | |
Weight (kg/pcs) | 0.68±0.1kg | 0.74±0.1kg | 1.36±0.1kg | |
Power consumption(watts/pcs) | 53 | 49 | 53 | |
Input Voltage(VDC) | 3.7 | 3.7 | 3.7 | |
Waterproof module surface | IP65 | IP65 | IP65 | |
Cabinet | Module quantity (pcs, W x H) | 4×3 | 4×3 | 4×3 |
Resolution(pixels/㎡) | 768×432 | 640×360 | 480×270 | |
Screen ratio | 16:9 | 16:9 | 16:9 | |
Size(W x H x D mm) | 592x333x37.6 | 592x333x37.6 | 592x333x37.6 | |
Square(㎡) | 0.197 | 0.197 | 0.197 | |
Weight(kg/㎡) | 5.65 | 5.65 | 5.65 | |
Pixel density(pixels/㎡) | 1682980 | 1168736 | 657414 | |
Cabinet Material & Color | Die-casting Aluminum, Black | |||
Waterproof | IP3X | IP3X | IP3X | |
Flatness of the box(mm) | ≤0.15 | ≤0.15 | ≤0.15 | |
Optical Parameters | Color temperature adjustable(K) | 3000-10000 | 3000-10000 | 3000-10000 |
Color Gamut | ≥105% NTSC | ≥105% NTSC | ≥105% NTSC | |
Brightness(nits)after correction | 0-600 | 0-600 | 0-600 | |
White color coordinates | TYP x=0.285,y=0.300±0.003 (9000K standard) | |||
Viewing angle, horizontal(°) | ≥160 | ≥160 | ≥160 | |
Viewing angle, vertical(°) | ≥160 | ≥160 | ≥160 | |
Contrast ratio | 15000:1 | 15000:1 | 15000:1 | |
Electrical Parameters | Power consumption, Max.(watts/㎡) | 540 | 500 | 540 |
Power consumption, Typical(watts/㎡) | 180 | 167 | 180 | |
Input voltage(V) | AC 100-240 (50/60HZ) | AC 100-240 (50/60HZ) | AC 100-240 (50/60HZ) | |
Visual Refresh | Drive method | 1/64 duty scans | 1/54 duty scans | 1/60 duty scans |
Frame frequency(HZ) | 50&60 | 50&60 | 50&60 | |
Refresh Rate(HZ) | 3840 | 3840 | 3840 | |
Grey scale(bit) | 14 | 13 | 13 | |
Applications
Environment |
LED life time(H) | 100000 | 100000 | 100000 |
Operating temperature(℃) | -10~+40 | -10~+40 | -10~+40 | |
Storage temperature(℃) | -40~+60 | -40~+60 | -40~+60 | |
Operating humidity(RH) | +10~+85%(non-condensing) | +10~+85%(non-condensing) | +10~+85%(non-condensing) | |
Storage humidity(RH) | +10~+60%(non-condensing) | +10~+60%(non-condensing) | +10~+60%(non-condensing) |
Note: Above parameters only reference, the final interpretation right of the above parameters belongs to ELITESDISPLAY TECHNOLOGY CO., LTD.